5.5 electrolyses electric capacities cannot touch the heating element, the high efficiency resistance, the sensitive resistance, the depressor, is hot and so on The solution electric capacity and the radiator gap smallest is 10.0MM, most is small its part to the radiator gap is 2.0MM.
5.6 large-scale primary devices (for example: The transformer, above the diameter 15.0MM electrolysis electric capacity, the big electric current plug and so on) enlarges the copper foil and on the tin area following chart; The shadow partial surface manure slightly wants and welds the plate area to be equal.

In 5.7 螺丝�?radii 5.0MM cannot have the copper foil (outside request earth) the part. (according to structure drawing request).
5.8 on tin positions cannot have the silk 印油
5.9 welds the plate center distance to be smaller than 2.5MM, neighboring welds the plate week defensive point on the frontier to have the silk 印油 package, 印油 the width is 0.2MM (discusses 0.5MM).
5.10 jumps the line not to have to put under IC or the motor, the potentiometer as well as under other great volume metal outer coverings parts
5.11 (approximately surpasses above 500CM2) in the big area PCB design, had prevented when tin stove PCB board curving, keeps among the PCB board not to put the primary device 5 to the 10MM width crevice (to walk line), uses for when the tin stove adds on prevented the PCB board is curving 压条, gets down the chart 阴影�? :

5.12 each grain of triode must leave e in the silk India superscript, c, the b foot
After 5.13 needs the part which the tin stove only then welds, the plate has had to open the tin position, has been opposite to and the tin direction, the oylet size is 0.5MM to the 1.0MM following chart:

5.14 designs when the double kneading board must pay attention, metal outer covering part, when plug-in unit the outer covering and the print board contact, the top layer welds the plate not to be possible to open, certainly must use the green oil or the silk 印油 covers (for example two feet crystal oscillators).
5.15 for reduces the spot to short-circuit, all two-sided prints board, 孔都 has not opened the green oil window.
On 5.16 each PCB all must use the solid arrow together to section out the tin stove direction:

Between 5.17 holes is away from slightly is 1.25MM (double kneading board is invalid)

When 5.18 layouts, DIP seal IC places the direction must become vertically with the tin stove direction, cannot be parallel, following chart; If in the layout has the difficulty, may allow the level to lay aside IC (OP seal IC to place direction and DIP is opposite).

5.19 wiring directions for level or vertical, by vertical changes over to the level to have to walk 45 to enter.
5.20 parts placing or are vertical for the level.
5.21 India character places for the level or right extension 90.
5.22 if the copper foil enters the circle to weld the plate the width round to weld plate the diameter hour, then must add the tear drop. Like chart:

5.23 materials codes and the design serial number need to put in the board vacancy.
5.24 does not have the wiring the place reasonably to do the earth or the power source uses.
5.25 wiring as far as possible short, specially pays attention to the clock line, the low level holding wire and all radio circuits wiring must be shorter.
5.26 analogous circuits and the digital circuit grounding and the power supply system must completely separate.
5.27 if on the print board has the big area grounding and the power line area (area surpasses 500 square millimeters), should partial open the window. Like chart:

5.28 electricity insert the print board the index hole stipulation to be as follows, the shadow part cannot put the part, the hand inserts the part to be an exception, the L scope is 50 330mm, the H scope is 50 250mm, the fruit is smaller than 50X50 to want 拼板to open the mold only then electricity to insert, if surpasses 330X250 to change the hand flapper. The index hole must in 长边 on.

Beijing results in the gate computer application research institute (the PCB enterprise department)